The second generation (2G) wireless phone will soon be history, replaced by the 2.3G handset offering a range of new features, including improved Internet and e-mail access, and many of the features of a personal digital assistant (PDA). The growth of wireless applications, combined with these new features, continues to hallenge radio frequency (RF) designers to incorporate more functions into a smaller space while at the same time increasing battery life, improving display quality, lowering cost and achieving new levels of manufacturing robustness.


High integrated transceivers are requited as the push for smaller and more advanced RF systems emerge. The use of Low temperature Co-fired Ceramic (LTCC) modules has been reported in the design of voltage-controlled oscillators (VCO), frequency synthesizers [1], and high frequency filters [2]. This paper describes the design and layout of a highly integrated radio transceiver module in LTCC. The application is intended for the Bluetooth wireless standard or for Home RF. While the bulk of this paper focuses on the LTCC module, a discussion on a first generation approach is given based on the LMX3162. Included is a study on surface board size estimates. The purpose of which is  to gain a better understanding for the high degree of integration that an LTCC solution has to offer.


LTCC (Low Temperature Co-fired Ceramic) products have low dielectric constant, low dielectric loss and the ability to embed multiple layers of resistors in a multilayer structure. So this combination of properties can make products of this material ideally suited for many high frequency applications like telecommunications, hi-elibility and medical products.